Linn has announced a major £1.1m investment for its factory located just outside Glasgow. Founded by Ivor Tiefenbrun in 1973, Linn remains an independent business and each and every product they make is built, tested and packaged in-house by one person who proudly signs their name on it.
Linn have upgraded machinery across the entire production process, including new surface mount technology which allows greater accuracy and flexibility when populating circuit boards. The business, with a turnover of £16.4m continues to see growth in both UK and Export markets.
Gilad Tiefenbrun, Linn’s Managing Director says: “We are passionate about precision engineering and this recent investment in renewing our production capabilities allows us to continue to innovate and create products with unbeatable performance. Linn makes the best audio systems in the world due to our meticulous research, development and production standards, allowing us to enrich people’s lives through music”.
Linn are utilising their factory investment across the following elements:
New Metalwork Machining Capability
Linn’s best performing Klimax product range is produced from solid raw aluminium billets. To improve the end-to-end production quality, the company have purchased the most advanced 5-axis metalwork machine to manufacture the machined-from-solid enclosure in-house. Engineered to protect the audio signal at every stage, the new machinery is able to precisely carve out multiple cavities within the Klimax.
New Surface Mount Technology
Four new component placement machines make up the second phase of Linn’s investment and provide enhanced manufacturing capability to create circuit boards of superior quality and performance. The new machines allow the use of significantly smaller components than before that can be placed with greater efficiency and precision. These improvements across Linn’s surface mount technology minimise the distance the audio signal travels between individual components.
Vapour Phase Soldering
Circuit board soldering accuracy has been optimised by replacing the traditional reflow process with the most up-to-date vapour-phase ovens available. Boards are placed directly inside a 230 degree vapour solution and solder is converted in an inert atmosphere as opposed to normal air. Normal air contains oxygen which can oxidise the solder joints to a very small degree. This move to vapour soldering ensures that each and every part of all Linn circuit boards are targeted with the right temperature at exactly the right time.
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